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DIGITAL EUROPE – Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration – 2026

Digital Europe Programme - Digital Europe programme aims at bridging the gap between digital technology research and market deployment.

2026-02-25
50 million euros
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Call synthesis

Call reference DIGITAL-JU-Chips-2025-SG-LFA
Programme DIGITAL EUROPE
Institution European Commission
Sectors Business & Industry Research & Innovation Technology & Digital
Beneficiaries Association & NGO Large company (> 250 employees) Professional organisation & network Research centre & university Smes & Start-Ups (< 249 Employees) Training organisation & school

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Call reference

DIGITAL-JU-Chips-2025-SG-LFA



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Priorities and funded actions

Objectives

  • To open up new opportunities for European-based semiconductor packaging companies and their supply chain by building on currently available services of RTOs and all Chips JU pilot lines
  • To prepare and speed up the transfer of technologies from pilot lines to industrial deployment

Eligibility

  • The eligibility conditions are described in Appendix 6 of the Chips JU Work Programme in the respective sections of “Eligibility” for each topic, as well as in “Annex II: General DIGITAL EUROPE PROGRAMME conditions” of the WP General Annexes.
  • Applicants must pay special attention to the consortia size limit and maximum EU contribution per partner compared to total consortium funding, as specified in the respective sections of “Eligibility” for each topic of Appendix 6.

Additional information

  • Contact: calls@chips-ju.europa.eu

Useful

Financement
  • Total budget of the call: 50 million euros
  • Amount of the grant: between 12 and 16 million euros
  • Funding rate: up to 50% of the total EU funding