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DIGITAL EUROPE – DIGITAL-JU-CHIPS-2025-SG-SSOI – 2025

Digital Europe Programme - Digital Europe programme aims at bridging the gap between digital technology research and market deployment.

2025-11-20
30 million euros
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Call synthesis

Call reference DIGITAL-JU-CHIPS-2025-SG-SSOI
Programme Digital Europe
Institution European Commission
Sectors Aeronautics & Space Business & Industry Civil Protection & Risks Cooperation & Development Education & Training Employment Environment & Climate Justice, Security, Defence Research & Innovation Social Economy Technology & Digital Territorial Development Transport
Beneficiaries Association & NGO EU & International Organisation Large company (> 250 employees) Local Authority & Affiliated Entity Research centre & university Smes & Start-Ups (< 249 Employees) State administration & affiliated entities Training organisation & school

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Call reference

DIGITAL-JU-CHIPS-2025-SG-SSOI



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Priorities and funded actions

Objectives

  • To develop industrial-grade sSOI substrates with reduced defect density to enhance electron mobility and overall device performance, supporting current (22FDX, 18nm) and future (7nm by 2030) FD-SOI technologies
  • To establish scalable, cost-effective manufacturing processes aligned with industrial standards for broad adoption
  • To demonstrate the integration of strained NMOS and relaxed PMOS regions for balanced transistor performance
  • To accelerate the transition from research to industrial-scale production through a pre-industrial infrastructure capable of producing thousands of wafers annually
  • To build demonstrators showcasing the advantages of sSOI-based FD-SOI over FinFET technologies, particularly in RF performance, noise reduction, and power efficiency
  • To provide open access to Process Design Kits (PDKs) and differentiated design blocks, including stress and relaxation features, to support innovation in FD-SOI
  • To enable early-stage design validation and system integration through Multi-Project Wafer (MPW) runs, supporting high-speed RF, mmWave radar, automotive, and IoT applications as part of the Next Gen FD-SOI roadmap

Priorities

  • Priority 1: To create a sustainable accelerator open to all European stakeholders, providing access to cutting-edge sSOI technologies and manufacturing capabilities
  • Priority 2: To develop and standardize Process Design Kits (PDKs) based on validated sSOI data, enabling optimized system-level designs and supporting the transition to 7nm FD-SOI by 2030
  • Priority 3: To scale sSOI substrate production to industrial levels, ensuring low defect densities and high manufacturing yields
  • Priority 4: To drive the development of intellectual property and reinforce Europe’s industrial capacity and leadership in critical semiconductor technologies
  • Priority 5: To foster synergies with the FD-SOI pilot line and other Chips JU pilot lines, strengthening collaboration and innovation across the European semiconductor ecosystem
  • Priority 6: To deliver comprehensive training and skills development programs for European technologists and engineers in sSOI integration and advanced semiconductor manufacturing

Among financed actions

  • Development of industrial-grade sSOI substrates
  • Defect reduction and improved electron mobility
  • Compatibility with existing FD-SOI processes
  • Integration of strained NMOS and relaxed PMOS
  • Scale-up to industrial production (thousands of wafers/year)
  • Demonstrators comparing sSOI vs. FinFET
  • Open access to Process Design Kits (PDKs)
  • Validation via Multi-Project Wafer (MPW) runs
  • Support for RF, radar, IoT, and automotive designs
  • Training and upskilling of technical workforce

Eligibility

  • Be a public or private entity
  • Be a non-profit making entity
  • Be: a NGO, a company, a university, a research institution, a SME, an organisation…
  • Be established in one of the eligible countries:
    • EU Member States (including overseas countries and territories)
    • Non-EU states: listed EEA countries
  • A consortium composed of maximum 70 applicant can be constituted

Additional information

  • Contact: calls@chips-ju.europa.eu

Useful

Financement
  • Total budget of the call: 30 million euros
  • Funding rate: between 25% and 35% of the total eligible costs